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Fiio M7

Προσθήκη αξιολόγησης

Κωδικός Προϊόντος: Fiio M7 Black

Fiio M7

Κωδικός Προϊόντος: Fiio M7 Black

The M7 is Fii0's first player to use Samsung's Exynos 7270 SoC (system on chip), made on the l4nm FinFET process. Compared to being made on the older 28nm process, the Exynos 7270's two ARM Cortex A53 cores use 20% less power for greater power efficiency and better battery life. The Exyn.. ...Περισσότερα
249,00  Τιμή με ΦΠΑ και Δωρεάν Μεταφορικά

Τιμή Καταλόγου: 261,00 €

Κερδίστε: 12,00 € (4.6%)

Διαθέσιμο σε μικρό χρονικό διάστημα ( 2-5 ημέρες )
249.00 € Τελική τιμή με ΦΠΑ και μεταφορικά
Τιμή Καταλόγου: 261,00 €
Κερδίζετε: 12,00 €

Δόσεις:

Διαθέσιμο σε μικρό χρονικό διάστημα ( 2-5 ημέρες )
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Λεπτομέρειες

The M7 is Fii0's first player to use Samsung's Exynos 7270 SoC (system on chip), made on the l4nm FinFET process. Compared to being made on the older 28nm process, the Exynos 7270's two ARM Cortex A53 cores use 20% less power for greater power efficiency and better battery life.

The Exynos 7270 is also made with Samsung's groundbreaking SiP-ePoP packaging technology -this allows the storage, power management, and memory chips to be all crammed with the ARM cores into a single tiny package 40% smaller than if the chips were packaged separately such as in existing technologies.This extra space allows for better cooling, and most importantly, a bigger battery to greatly improve play time. 

State-of-the-art 6-layer multi-stage Blind and Buried Via PCB technology 
Because of the Exynos 7270's SiP-ePoP packaging technology, integrating it with the rest of the M7's printed circuit board (PCB) was a challenge but also allowed us to explore and implement new technologies. Thus, the M7 is the first digital audio player to contain a 6-layer multi-stage H DI (high density interconnect) PCB, the same kind that is used in the latest smartphones. Being only 0.8mm thick, this allowed us to cram much more functionality into the body of the M7. Furthermore, we also employ blind and buried vias on the PCB, which allows the different components to work more closely in harmony as well as make the power supply section much more robust, guaranteeing superior first-rate sound quality. 

The next step in audio: high fidelity wireless 
The M7 utilizes a Samsung Bluetooth 4.2 chip that supports the aptX-HD audio codec, allowing you to enjoy your music in high fidelity without the hassle of wires. In addition, the M7 also supports Sony's LDAC wireless audio codec, which compared to ordinary Bluetooth audio transmits 3x the data for an unparalleled, truly high -resolution audio experience. 

Χαρακτηριστικά:

  • CPU model: Exynos 7270 14nm
  • CPU operating frequency: 1.4GHz
  • Keyboard: Virtual QWERTY keyboard
  • Special features: LDAC, FM radio, clock, gestures operation
  • Chips used: SoC: Samsung Exynos 7270 , DAC: ES9018Q2C, FM chip: Si4705, Bluetooth chip: SAMSUNG S5N5C10B01-6330
  • Operating System: Deeply customized Android
  • No. of cores: 4
  • Input method: Touchscreen
  • User interface: Deeply customized /FiiO Music
  • Display size: 3.2 inches
  • Display type: TFT
  • Resolution: 480x800
  • Number of colours: 0.26 million colors
  • Viewable angle: Full-view
  • Pixel density: 292 ppi
  • Weight : 78 g
  • Dimensions : 19.1 mm×80 mm×21 mm
  • Colors: Black, Silver

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